Jim Straus is helping power the next wave of semiconductor innovation by improving one of the most critical and overlooked parts of chip manufacturing: the process. As Head of Sales and Service at ACM Research, Jim works with leading chipmakers around the world to increase yield, reduce waste, and unlock more production from every wafer through advanced wet cleaning and electroplating technologies.

In this episode, Russ and Jim explore how ACM Research fits into the global semiconductor ecosystem, not by building chips themselves, but by designing the highly complex equipment and processes that make modern chip production possible. Jim explains how their technology integrates mechanical, chemical, and software systems to deliver measurable improvements in yield, and why that has been the foundation of their rapid growth.

They also discuss the massive demand being driven by AI, the increasing complexity of chip design, and how innovations like panel level packaging could reshape the economics of semiconductor manufacturing. Jim breaks down how moving from traditional round wafers to larger square panels can dramatically reduce waste and costs while increasing output, and why this transition presents both a major opportunity and a significant industry challenge.

Along the way, Jim shares insights on sustainability in semiconductor manufacturing, the importance of aligning roadmaps with customers, and why close collaboration across the ecosystem is essential to keeping up with rapid development cycles. He also highlights ACM’s expansion in the United States and what it will take to bring more semiconductor manufacturing and innovation back home.

Topics Covered:

[00:01] Welcome and intro, Jim Straus and ACM Research’s award win

[00:36] What ACM Research does in the semiconductor manufacturing ecosystem

[02:00] Global growth, operations in Asia, and expansion into the US and Europe

[03:22] How wet clean technology impacts every step of chip production

[04:24] AI driven demand and the global importance of semiconductor supply

[05:43] Innovations in wafer level and panel level packaging

[07:21] Why moving to square panels can reduce cost and increase efficiency

[08:46] Sustainability efforts in reducing chemicals and waste

[10:00] Ideal customers from large chipmakers to specialized innovators

[11:00] Breakthroughs in electroplating and improving uniformity

[12:17] How customers measure yield improvements from ACM technology

[13:25] Accelerating product development cycles in the AI era

[14:28] Investing in US manufacturing and R&D capabilities

[16:16] The importance of co creation and aligning with customer roadmaps

[17:24] Challenges ahead with panel level packaging adoption

[18:51] Advanced cleaning techniques without damaging wafer structures

Links and Resources:

ACM Research: https://www.acmrcsh.com

Business Intelligence Group: https://www.bintelligence.com

BIG Awards for Business: https://www.bintelligence.com/awards/big-awards-for-business

About The Winners Circle:

The Winners Circle is hosted by Russ Fordyce, CEO and founder of Business Intelligence Group. Each episode features leaders and innovators recognized through BIG’s annual award programs across AI, innovation, sustainability, cybersecurity, and more. Subscribe wherever you get your podcasts.

Nominate your company or team for a BIG award: https://www.bintelligence.com