Episodes

  • Accelerated Embedded Systems for Physical AI
    May 26 2026

    Physical AI is the latest term for robot and drones with a mix of AI allowing them to be smarter and more robust. The latest crop of physical AI devices include more sensors that feed more AI models to provide the robot with a better understanding of its environment. These sensors often include cameras and distance sensors like LiDAR and radar. In this episode, Yaniv Sulkes, Vice President of Physical AI at Hailo, talks about issues and solutions related to physical AI systems.

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    21 mins
  • Flyback Design in Practice: From PoE to Offline AC/DC
    May 22 2026

    This episode of Inside Electronics, sponsored by DigiKey and Wurth Elektronik, focuses on flyback power electronics and how they are applied across different power-supply designs, especially power over Ethernet and offline AC/DC systems.

    Host Alix Paultre introduces the topic and guides the discussion, while Jared Birk, Technical Marketing Engineer with Wurth Elektronik, shares his technical perspective and practical design experience.

    Alix and Jared discuss why flybacks remain important despite being an older topology: they are simple, versatile, efficient across a wide input range, and useful for both low-power and isolated applications.

    The conversation emphasizes the trade-offs engineers face, including EMI, thermal limits, switching losses, parasitic effects, and safety isolation requirements. Jared stresses that design success depends on balancing these constraints and consulting component suppliers early. The episode closes with an encouraging message that flyback design is both practical and fun.

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    16 mins
  • Celebrating 50 Years of NI at NI Connect 2026
    May 19 2026

    National Instruments (NI) was started 50 years ago by Dr. Truchard—known to many as "Dr. T"—along with Jeff Kodosky and Bill Nowlin.". NI recently became part of Emerson. He was joined by Ritu Favre, President, Test and Measurement Business Group, and Kevin Schultz (CTO) at this year’s NI Connect 2026 in Fort Worth, TX. In this episode of Inside Electronics, we talk with Ritu Favre about NI in general and about LabVIEW’s Nigel AI.

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    12 mins
  • Power Design Made Simple: RECOM Power's Discrete Solutions
    May 15 2026

    This episode of Inside Electronics, sponsored by DigiKey and RECOM Power, focuses on next-generation power solutions and the tradeoffs between modular and discrete power designs. The episode also covers key topologies, and how engineers can optimize for cost, size, efficiency, and time to market.

    Host Alix Paultre introduces the topic and interviews Steve Roberts, Innovation Manager at RECOM Power. The conversation covers why power supply design is moving earlier in the product-development process, how modular solutions speed prototyping, and how discrete solutions can reduce cost and enable more customized, compact designs at higher volumes.

    Alix and Steve also cover the main topologies—push-pull, full bridge, and flyback—and how RECOM Power supports engineers with preselected parts, evaluation boards, and combined driver/transformer solutions.

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    15 mins
  • SensorGPT Shortens the Edge AI Training Cycle
    May 12 2026

    The emergence of "Physical AI" requires a bridge between digital logic and the chaotic variables of the analog world. TDK's SensorGPT serves as this bridge by creating a feedback loop: synthetic data trains the initial model, and the limited real-world data subsequently gathered is used to refine the generative parameters.

    Hear more about SensorGPT applications, capabilities and about its limitations and availability as Electronic Design Technology Editor Andy Turudic has a discussion with Abbas Ataya, Sr. Director of AI Systems & Software at TDK USA, in this edition of the Inside Electronics podcast.

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    31 mins
  • Engineering the Fit: Modified Enclosures That Meet Your Design Needs
    May 8 2026

    This episode of Inside Electronics, sponsored by DigiKey and Hammond Manufacturing, is a conversation about modified enclosures and how they can better meet design needs. Host Alex Paultre interviews Allyn Weilacher, Marketing Operations Specialist at Hammond. The discussion centers on why enclosures matter as the “body” of an electronic project, protecting components from weather, EMI/RFI, and harsh environments.

    They also cover customization choices such as cutouts, labels, internal hardware, materials, IP ratings, and support for grounding or board mounting. A major theme is the practical workflow: Customers can use Hammond or DigiKey tools, upload dimensioned drawings, review pricing, approve a sample, and then place production orders starting at 25 units.

    Alix and Allyn emphasize that the process is meant to be intuitive, transparent, and supported by direct engineering help when needed, with saved drawings making repeat orders or minor changes easy.

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    11 mins
  • Tamper Detection and Prevention in Electronic Systems
    May 5 2026

    Consumer trust is a foundational element of any successful business, yet many companies don’t pay enough attention to tampering prevention in their products and systems.

    A single case of tampering can trigger recalls, lawsuits, and lost customers, and negative press spreads quickly. Once trust is broken, rebuilding it is very difficult and expensive. In this podcast, we talk to Chris Morrison, VP of Product Marketing at Agile Analog, about the issues around tempering in electronic systems.

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    13 mins
  • What’s Next for Automotive Memory? Why AI Demand Is Changing the Industry
    May 1 2026

    As demand for memory in AI servers continues to grow, suppliers are shifting focus. This is creating new challenges for the automotive industry. Longer lead times, tighter supply, and shifting product strategies are forcing automakers and suppliers to rethink how they plan and design systems, raising the risk of component shortages and costly redesigns.

    In this episode of Inside Electronics, host Alix Palture sits down with Jun Kawaguchi of Winbond who breaks down both the challenges and opportunities and how these market dynamics are impacting automotive memory as suppliers prioritize higher-value segments and reshape capacity across the semiconductor industry.

    This conversation also explores new memory demand for higher density and performance as vehicles evolve from L2 to L2+ and higher segments from L3 to L3+, as well as the emergence of ADAS in 2-wheeled products like scooters.

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    14 mins